Informationen zu Lehrveranstaltungen in →Opal / Information about lectures can be found in →Opal

Skip to content.


search  |  internal  |  deutsch
Personal tools
TU Dresden » Faculty of Mechanical Science and Engineering » Institute for Materials Science » Chair of Materials Science and Nanotechnology

For a complete list, check out Google Scholar.

prev/next pubs | 2009 | 2008 | 2007 | 2006 | 2005 | 2004 | 2003 | 2002 | 2001 | 2000 | 1999 | 1998 | 1997 | 1996



Copper Electroplating with Polyethylene Glycol II. Experimental Analysis and Determination of Model Parameters

H. Yang, R. Krause, C. Scheunert, R. Liske, B. Uhlig, A. Preusse, A. Dianat, M. Bobeth, and G. Cuniberti

J. Electrochem. Soc. 165, D13-D22 (2018)

In the electrochemical deposition of copper on structured substrates, additives are commonly used as ingredients to refine the copper thin film properties. By means of cyclovoltametric (CV) measurements, we examine the process behavior of the additives PEG (polyethylene glycol) and chloride ions over a wide range of experimental parameters relevant for production-like conditions. In this plating process, additives practically are neither consumed in chemical reactions nor are they incorporated into the growing copper film. To understand the observed complex hysteresis behavior of the deposition current in CV scans, we have recently proposed a model which is able to qualitatively explain this behavior without supposing additive consumption. In the present study, we fit crucial parameters of this model from the experimental data to increase its predictive power. The quantitative agreement of performed simulations of CV scans with the measured scans demonstrates the validity of the proposed copper deposition model. Equipped with the determined parameter set, the model can help to optimize the copper plating process in industrial applications.

doi absolute link10.1149/2.0081802jes
export BibTeX citation (txt file)
export EndNote citation (ris file)

prev/next 2009 | 2008 | 2007 | 2006 | 2005 | 2004 | 2003 | 2002 | 2001 | 2000 | 1999 | 1998 | 1997 | 1996


last modified: 2021.09.01 Wed
author: webadmin