DFT study of interaction of additives with Cu(111) surface relevant to Cu electrodeposition
Journal of Applied Electrochemistry 48, 211 (2018).
A. Dianat, H. Yang, M. Bobeth, and G. Cuniberti.
Journal DOI: https://doi.org/10.1007/s10800-018-1150-1

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©10.1007/s10800-018-1150-1
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