SILTECTRA™



Description

The SILTECTRA™ COLD SPLIT technology splits crystalline materials with minimal loss of material compared to common sawing technologies.

Founded in 2010 in Dresden, Germany and with a small but expert team SILTECTRA™ is a young, innovative company, specializing in new splitting technologies of semiconductor materials.

German semiconductor manufacturer Infineon acquired Siltectra in 2018.

SILTECTRA™



Description

The SILTECTRA™ COLD SPLIT technology splits crystalline materials with minimal loss of material compared to common sawing technologies.

Founded in 2010 in Dresden, Germany and with a small but expert team SILTECTRA™ is a young, innovative company, specializing in new splitting technologies of semiconductor materials.

German semiconductor manufacturer Infineon acquired Siltectra in 2018.